Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits 著者: Gustilo, Paul Angelo D.

Advanced materials for thermal management of electronic packaging 著者: Tong, Xingcun Colin

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Plastics for electronics materials, properties, and design applications 著者: Alvino, William M.

Materials for electronic packaging

Soldering processes and equipment

Characterization of integrated circuit packaging materials

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Characterization of integrated circuit packaging materials

Polymeric materials for electronics packaging and interconnection

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy