תוצאות חיפוש - "Electronic packaging Materials"
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Polymeric materials for electronics packaging and interconnection
יצא לאור 1989Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy
Electronic Resource -
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Characterization of integrated circuit packaging materials
יצא לאור 1993Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource -
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