検索結果 1 - 10 結果 / 37 検索語 '"Electronic packaging"', 処理時間: 0.02秒 結果の絞り込み
  1. 1

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.

    出版事項 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.
  2. 2

    Reliability of power electronic converter systems

    出版事項 2015
    Available for University of the Philippines Diliman via IET Digital Library. Click here to access
    Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
    Electronic Resource

    Reliability of power electronic converter systems
  3. 3

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits 著者: Gustilo, Paul Angelo D.

    出版事項 2014
    学位論文

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits
  4. 4

    Essentials of electronic packaging a multidisciplinary approach 著者: Viswanadham, Puligandla

    出版事項 2011
    Available for University of the Philippines Diliman College of Engineering via ASME. Click here to access
    Also available remotely for University of the Philippines Diliman College of Engineering via ASME. Click here to access thru EZproxy
    Electronic Resource

    Essentials of electronic packaging a multidisciplinary approach
  5. 5

    Adhesives technology for electronic applications materials, processing, reliability 著者: Licari, James J. 1930-

    出版事項 2011
    Available for University of the Philippines System via ScienceDirect. Click here to access
    Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
    Electronic Resource

    Adhesives technology for electronic applications materials, processing, reliability
  6. 6

    Advanced materials for thermal management of electronic packaging 著者: Tong, Xingcun Colin

    出版事項 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  7. 7

    Wire bonding in microelectronics 著者: Harman, George G.

    出版事項 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Wire bonding in microelectronics
  8. 8

    Nanopackaging nanotechnologies and electronics packaging

    出版事項 2008
    図書

    Nanopackaging nanotechnologies and electronics packaging
  9. 9

    Journal of electronic packaging.

    出版事項 2004
    図書

    Journal of electronic packaging.
  10. 10

    Fundamentals of microsystems packaging

    出版事項 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of microsystems packaging

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