Bilaketaren emaitzak - "Electronic packaging"
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Quality conformance and qualification of microelectronic packages and interconnects
Argitaratua 1994Liburua -
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Wire bonding in microelectronics
Argitaratua 2010Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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