Manufacturing processes and materials challenges in microelectronic packaging presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Atlanta, Georg...

Circuits, interconnections, and packaging for VLSI by Bakoglu, H. B. 1958-

Principles of electronic packaging

Polymeric materials for electronics packaging and interconnection

Available for University of the Philippines Diliman via ACS Publications. Click here to access
Also available remotely for University of the Philippines Diliman via ACS Publications. Click here to access thru EZproxy

A statistical quality control study on ZiLOG Electronics Philippines, Inc. (ZEPI) by Del Rosario, Geraldine, Molar, Ma. Theresa O., Talan, Mark Anthony

Power to the package. by Herrell, D.

Moisture and thermal degradation of Cyanate-Ester-Based Die Attach Material by Gonzales, John Ivan J.

Also available online for University of the Philippines Diliman. Click here

Thermal management in electronic packages by Mena, Manolo G.

Also available online for University of the Philippines Diliman. Click here

Microelectronics international.

Available for UP System via Emerald eJournals Premier.