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  1. 301

    Analog circuit simulators for integrated circuit designers numerical recipes in Python by Sahrling, Mikael

    Published 2021
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    Analog circuit simulators for integrated circuit designers numerical recipes in Python
  2. 302

    Advances in engineering design select proceedings of FLAME 2020

    Published 2021
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    Advances in engineering design select proceedings of FLAME 2020
  3. 303

    Design and development of MEMS based guided beam type piezoelectric energy harvester by Saxena, Shanky, Sharma, Ritu, Pant, B. D.

    Published 2021
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    Design and development of MEMS based guided beam type piezoelectric energy harvester
  4. 304

    Coefficient diagram method for control system design by Manabe, Shunji 1945-, Kim, Young Chol

    Published 2021
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    Coefficient diagram method for control system design
  5. 305

    Proceedings of the Munich symposium on lightweight design 2020

    Published 2021
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    Proceedings of the Munich symposium on lightweight design 2020
  6. 306

    Embedded systems - a hardware-software co-design approach unleash the power of Arduino! by Morshed, Bashir I.

    Published 2021
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    Embedded systems - a hardware-software co-design approach unleash the power of Arduino!
  7. 307

    Design for testability, debug and reliability next generation measures using formal techniques by Huhn, Sebastian, Drechsler, Rolf

    Published 2021
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    Design for testability, debug and reliability next generation measures using formal techniques
  8. 308

    Designing sustainability for all the design of sustainable product-service systems applied to distributed economies.

    Published 2021
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    Designing sustainability for all the design of sustainable product-service systems applied to distributed economies.
  9. 309

    Advances on mechanics, design engineering and manufacturing III Proceedings of the international Joint Conference on Mechanics, design engineering and advanced manufacturing, JCM 2...

    Published 2021
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    Advances on mechanics, design engineering and manufacturing III Proceedings of the international Joint Conference on Mechanics, design engineering and advanced manufacturing, JCM 2020, June 2-4 2020.
  10. 310

    Semiconductor advanced packaging by Lau, John H.

    Published 2021
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    Semiconductor advanced packaging

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