Introduction to system-on-package (SOP) miniaturization of the entire system 由 Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system 由 Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs 由 Sherwani, Naveed A.

Physical design for multichip modules 由 Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability 由 Pecht, Michael

Electronics packaging forum multichip module technology issues