Introduction to system-on-package (SOP) miniaturization of the entire system 著者: Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system 著者: Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs 著者: Sherwani, Naveed A.

Physical design for multichip modules 著者: Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability 著者: Pecht, Michael

Electronics packaging forum multichip module technology issues