Introduction to system-on-package (SOP) miniaturization of the entire system Autor Tummala, Rao R. 1942-

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System-on-package (SOP) miniaturization of the entire system Autor Tummala, Rao R. 1942-

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Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Autor Sherwani, Naveed A.

Physical design for multichip modules Autor Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Autor Pecht, Michael

Electronics packaging forum multichip module technology issues