Đang hiển thị 1 - 6 kết quả của 6 cho tìm kiếm '', thời gian truy vấn: 0.01s Tinh chỉnh kết quả
  1. 1

    3D stacked chips from emerging processes to heterogeneous systems

    Được phát hành 2016
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    3D stacked chips from emerging processes to heterogeneous systems
  2. 2

    3D IC integration and packaging Bằng Lau, John H.

    Được phát hành 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  3. 3

    Arbitrary modeling of TSVs for 3D integrated circuits Bằng Salah, Khaled, Ismail, Yehea I. 1971-, El-Rouby, Alaa

    Được phát hành 2015
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    Arbitrary modeling of TSVs for 3D integrated circuits
  4. 4

    Design of 3D integrated circuits and systems

    Được phát hành 2015
    Available for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access
    Also available remotely for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access thru EZproxy
    Electronic Resource

    Design of 3D integrated circuits and systems
  5. 5

    Through-silicon vias for 3D integration Bằng Lau, John H.

    Được phát hành 2013
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Through-silicon vias for 3D integration
  6. 6

    Three-dimensional integrated circuit design Bằng Pavlidis, Vasilis F. 1976-

    Được phát hành 2009
    Sách

    Three-dimensional integrated circuit design

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