3D stacked chips from emerging processes to heterogeneous systems

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3D IC integration and packaging по Lau, John H.

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Arbitrary modeling of TSVs for 3D integrated circuits по Salah, Khaled, Ismail, Yehea I. 1971-, El-Rouby, Alaa

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Design of 3D integrated circuits and systems

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Through-silicon vias for 3D integration по Lau, John H.

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Three-dimensional integrated circuit design по Pavlidis, Vasilis F. 1976-