3D stacked chips from emerging processes to heterogeneous systems

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

3D IC integration and packaging de réir Lau, John H.

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Arbitrary modeling of TSVs for 3D integrated circuits de réir Salah, Khaled, Ismail, Yehea I. 1971-, El-Rouby, Alaa

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Design of 3D integrated circuits and systems

Available for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access
Also available remotely for University of the Philippines Diliman College of Engineering via CRCnetBASE. Click here to access thru EZproxy

Through-silicon vias for 3D integration de réir Lau, John H.

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Three-dimensional integrated circuit design de réir Pavlidis, Vasilis F. 1976-