Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces 由 Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
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Fundamentals of lead-free solder interconnect technology from microstructures to reliability 由 Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

Available for University of the Philippines System via SpringerLink. Click here to access
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Quality hand soldering and circuit board repair 由 Smith, H. Ted

The art of soldering for jewelry makers techniques and projects 由 Devenney, Wing Mun

Lead-free solder process development

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects 由 Grossmann, Günter, Zardini, Christian

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... 由 Manauis, Melissa B.

Soldering in electronics assembly 由 Judd, Mike, Brindley, Keith

Available for University of the Philippines System via ScienceDirect. Click here to access
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Modern solder technology for competitive electronics manufacturing 由 Hwang, Jennie S.

The handbook of machine soldering SMT and TH. 由 Woodgate, Ralph W. 1922-