Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces по Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
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Fundamentals of lead-free solder interconnect technology from microstructures to reliability по Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

Available for University of the Philippines System via SpringerLink. Click here to access
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Quality hand soldering and circuit board repair по Smith, H. Ted

The art of soldering for jewelry makers techniques and projects по Devenney, Wing Mun

Lead-free solder process development

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects по Grossmann, Günter, Zardini, Christian

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... по Manauis, Melissa B.

Soldering in electronics assembly по Judd, Mike, Brindley, Keith

Available for University of the Philippines System via ScienceDirect. Click here to access
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Modern solder technology for competitive electronics manufacturing по Hwang, Jennie S.

The handbook of machine soldering SMT and TH. по Woodgate, Ralph W. 1922-