Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces de réir Zhang, Qingke

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Fundamentals of lead-free solder interconnect technology from microstructures to reliability de réir Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

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Quality hand soldering and circuit board repair de réir Smith, H. Ted

The art of soldering for jewelry makers techniques and projects de réir Devenney, Wing Mun

Lead-free solder process development

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects de réir Grossmann, Günter, Zardini, Christian

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... de réir Manauis, Melissa B.

Soldering in electronics assembly de réir Judd, Mike, Brindley, Keith

Available for University of the Philippines System via ScienceDirect. Click here to access
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Modern solder technology for competitive electronics manufacturing de réir Hwang, Jennie S.

The handbook of machine soldering SMT and TH. de réir Woodgate, Ralph W. 1922-