Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces af Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Fundamentals of lead-free solder interconnect technology from microstructures to reliability af Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Quality hand soldering and circuit board repair af Smith, H. Ted

The art of soldering for jewelry makers techniques and projects af Devenney, Wing Mun

Lead-free solder process development

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects af Grossmann, Günter, Zardini, Christian

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... af Manauis, Melissa B.

Soldering in electronics assembly af Judd, Mike, Brindley, Keith

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

Modern solder technology for competitive electronics manufacturing af Hwang, Jennie S.

The handbook of machine soldering SMT and TH. af Woodgate, Ralph W. 1922-