Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces Autor Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
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Fundamentals of lead-free solder interconnect technology from microstructures to reliability Autor Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

Available for University of the Philippines System via SpringerLink. Click here to access
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Quality hand soldering and circuit board repair Autor Smith, H. Ted

The art of soldering for jewelry makers techniques and projects Autor Devenney, Wing Mun

Lead-free solder process development

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects Autor Grossmann, Günter, Zardini, Christian

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... Autor Manauis, Melissa B.

Soldering in electronics assembly Autor Judd, Mike, Brindley, Keith

Available for University of the Philippines System via ScienceDirect. Click here to access
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Modern solder technology for competitive electronics manufacturing Autor Hwang, Jennie S.

The handbook of machine soldering SMT and TH. Autor Woodgate, Ralph W. 1922-