Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces অনুযায়ী Zhang, Qingke

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Fundamentals of lead-free solder interconnect technology from microstructures to reliability অনুযায়ী Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

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Quality hand soldering and circuit board repair অনুযায়ী Smith, H. Ted

The art of soldering for jewelry makers techniques and projects অনুযায়ী Devenney, Wing Mun

Lead-free solder process development

The ELFNET book on failure mechanisms, testing methods, and quality issues of lead-free solder interconnects অনুযায়ী Grossmann, Günter, Zardini, Christian

Available for University of the Philippines Diliman via SpringerLink. Click here to access

Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... অনুযায়ী Manauis, Melissa B.

Soldering in electronics assembly অনুযায়ী Judd, Mike, Brindley, Keith

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Modern solder technology for competitive electronics manufacturing অনুযায়ী Hwang, Jennie S.

The handbook of machine soldering SMT and TH. অনুযায়ী Woodgate, Ralph W. 1922-