-
1
-
2
Semiconductor advanced packaging
Gepubliceerd in 2021Volledige tekst
Volledige tekst
Electronic Resource -
3
-
4
-
5
-
6
Investigation of silicon die crack for varying silicon die parameters and die attach material
Gepubliceerd in Philippine Engineering Journal (2020)Artikel -
7
Printing of graphene and related 2D materials technology, formulation and applications
Gepubliceerd in 2019Available for University of the Philippines Diliman via SpringerLink. Click here to access
Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
8
Light-emitting diodes materials, processes, devices and applications
Gepubliceerd in 2019Available for University of the Philippines Diliman via SpringerLink. Click here to access
Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
9
Electromagnetic transients of power electronics systems
Gepubliceerd in 2019Available for University of the Philippines Diliman via SpringerLink. Click here to access
Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
10
Characterisation and control of defects in semiconductors
Gepubliceerd in 2019Available for University of the Philippines Diliman via IET Digital Library. Click here to access
Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
Electronic Resource


