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Semiconductor advanced packaging
منشور في 2021احصل على النص الكامل
احصل على النص الكامل
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Investigation of silicon die crack for varying silicon die parameters and die attach material
الحاوية / القاعدة Philippine Engineering Journal (2020)مقال -
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Light-emitting diodes materials, processes, devices and applications
منشور في 2019Available for University of the Philippines Diliman via SpringerLink. Click here to access
Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy
Electronic Resource -
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Characterisation and control of defects in semiconductors
منشور في 2019Available for University of the Philippines Diliman via IET Digital Library. Click here to access
Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
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1D semiconducting nanostructures for flexible and large-area electronics growth mechanisms and suitability
منشور في 2019Available for University of the Philippines Diliman via Cambridge Core. Click here to access
Also available remotely for University of the Philippines Diliman via Cambridge Core. Click here to access thru EZproxy
Electronic Resource