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  1. 1

    Handbook of wafer bonding

    出版 2012
    圖書

    Handbook of wafer bonding
  2. 2

    Characterization of silicon p-n junctions fabricated by ion shower doping 由 Diaz, Jose Mario A.

    出版 2004
    Thesis

    Characterization of silicon p-n junctions fabricated by ion shower doping
  3. 3

    Understanding the effect of surface flaws on fracture of silicon die 由 Punzalan, Jaime C.

    出版 2003
    Thesis

    Understanding the effect of surface flaws on fracture of silicon die
  4. 4

    Handbook of semiconductor wafer cleaning technology science, technology, and applications

    出版 1993
    圖書

    Handbook of semiconductor wafer cleaning technology science, technology, and applications
  5. 5

    Warpage characterization for silicon-based integrated circuits 由 Montesa, Christine Marie C.

    Thesis

    Warpage characterization for silicon-based integrated circuits
  6. 6

    Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics 由 Fabular, Jennifer J.

    Thesis

    Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics

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