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  1. 1

    Handbook of wafer bonding

    Pubblicazione 2012
    Libro

    Handbook of wafer bonding
  2. 2

    Characterization of silicon p-n junctions fabricated by ion shower doping di Diaz, Jose Mario A.

    Pubblicazione 2004
    Tesi

    Characterization of silicon p-n junctions fabricated by ion shower doping
  3. 3

    Understanding the effect of surface flaws on fracture of silicon die di Punzalan, Jaime C.

    Pubblicazione 2003
    Tesi

    Understanding the effect of surface flaws on fracture of silicon die
  4. 4

    Handbook of semiconductor wafer cleaning technology science, technology, and applications

    Pubblicazione 1993
    Libro

    Handbook of semiconductor wafer cleaning technology science, technology, and applications
  5. 5

    Warpage characterization for silicon-based integrated circuits di Montesa, Christine Marie C.

    Tesi

    Warpage characterization for silicon-based integrated circuits
  6. 6

    Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics di Fabular, Jennifer J.

    Tesi

    Analysis of die tilt effect on silicon die crack propagation in a small outline transistor using computational fracture mechanics

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