System-on-package (SOP) miniaturization of the entire system 由 Tummala, Rao R. 1942-

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Introduction to system-on-package (SOP) miniaturization of the entire system 由 Tummala, Rao R. 1942-

Table of contents only

Multichip module technology handbook 由 Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs 由 Sherwani, Naveed A.

Introduction to multichip modules 由 Sherwani, N. A. (Naveed A.)

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability 由 Pecht, Michael

Physical design for multichip modules 由 Sriram, M. (Mysore) 1966-