Introduction to system-on-package (SOP) miniaturization of the entire system Bằng Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system Bằng Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Multichip module technology handbook Bằng Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Bằng Sherwani, Naveed A.

Introduction to multichip modules Bằng Sherwani, N. A.

Physical design for multichip modules Bằng Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Bằng Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues