Introduction to system-on-package (SOP) miniaturization of the entire system Yazar: Tummala, Rao R. 1942-

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System-on-package (SOP) miniaturization of the entire system Yazar: Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook Yazar: Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Yazar: Sherwani, Naveed A.

Introduction to multichip modules Yazar: Sherwani, N. A.

Physical design for multichip modules Yazar: Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Yazar: Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues