Introduction to system-on-package (SOP) miniaturization of the entire system av Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system av Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook av Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs av Sherwani, Naveed A.

Introduction to multichip modules av Sherwani, N. A.

Physical design for multichip modules av Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability av Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues