Introduction to system-on-package (SOP) miniaturization of the entire system по Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system по Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook по Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs по Sherwani, Naveed A.

Introduction to multichip modules по Sherwani, N. A.

Physical design for multichip modules по Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability по Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues