Introduction to system-on-package (SOP) miniaturization of the entire system Por Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system Por Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook Por Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Por Sherwani, Naveed A.

Introduction to multichip modules Por Sherwani, N. A.

Physical design for multichip modules Por Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Por Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues