Introduction to system-on-package (SOP) miniaturization of the entire system door Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system door Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook door Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs door Sherwani, Naveed A.

Introduction to multichip modules door Sherwani, N. A.

Physical design for multichip modules door Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability door Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues