Introduction to system-on-package (SOP) miniaturization of the entire system di Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system di Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook di Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs di Sherwani, Naveed A.

Introduction to multichip modules di Sherwani, N. A.

Physical design for multichip modules di Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability di Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues