Introduction to system-on-package (SOP) miniaturization of the entire system od Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system od Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook od Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs od Sherwani, Naveed A.

Introduction to multichip modules od Sherwani, N. A.

Physical design for multichip modules od Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability od Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues