Introduction to system-on-package (SOP) miniaturization of the entire system द्वारा Tummala, Rao R. 1942-

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System-on-package (SOP) miniaturization of the entire system द्वारा Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook द्वारा Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs द्वारा Sherwani, Naveed A.

Introduction to multichip modules द्वारा Sherwani, N. A.

Physical design for multichip modules द्वारा Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability द्वारा Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues