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Introduction to system-on-package (SOP) miniaturization of the entire system
Foilsithe / Cruthaithe 2008Table of contents only
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System-on-package (SOP) miniaturization of the entire system
Foilsithe / Cruthaithe 2008Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
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Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability
Foilsithe / Cruthaithe 1994LEABHAR -
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Microelectronic system interconnections performance and modeling
Foilsithe / Cruthaithe 1994LEABHAR -
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