System-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-

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Introduction to system-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-

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Multichip module technology handbook Tekijä Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Tekijä Sherwani, Naveed A.

Introduction to multichip modules Tekijä Sherwani, N. A. (Naveed A.)

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Tekijä Pecht, Michael

Physical design for multichip modules Tekijä Sriram, M. (Mysore) 1966-