Introduction to system-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system Tekijä Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook Tekijä Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs Tekijä Sherwani, Naveed A.

Introduction to multichip modules Tekijä Sherwani, N. A.

Physical design for multichip modules Tekijä Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability Tekijä Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues