Introduction to system-on-package (SOP) miniaturization of the entire system nork Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system nork Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook nork Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs nork Sherwani, Naveed A.

Introduction to multichip modules nork Sherwani, N. A.

Physical design for multichip modules nork Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability nork Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues