Introduction to system-on-package (SOP) miniaturization of the entire system von Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system von Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook von Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs von Sherwani, Naveed A.

Introduction to multichip modules von Sherwani, N. A.

Physical design for multichip modules von Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability von Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues