System-on-package (SOP) miniaturization of the entire system von Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy

Introduction to system-on-package (SOP) miniaturization of the entire system von Tummala, Rao R. 1942-

Table of contents only

Multichip module technology handbook von Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs von Sherwani, Naveed A.

Introduction to multichip modules von Sherwani, N. A. (Naveed A.)

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability von Pecht, Michael

Physical design for multichip modules von Sriram, M. (Mysore) 1966-