Introduction to system-on-package (SOP) miniaturization of the entire system per Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system per Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook per Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs per Sherwani, Naveed A.

Introduction to multichip modules per Sherwani, N. A.

Physical design for multichip modules per Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability per Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues