Introduction to system-on-package (SOP) miniaturization of the entire system حسب Tummala, Rao R. 1942-

Table of contents only

System-on-package (SOP) miniaturization of the entire system حسب Tummala, Rao R. 1942-

Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
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Multichip module technology handbook حسب Garrou, Philip E.

Flip chip technologies

Routing in the third dimension from VLSI chips to MCMs حسب Sherwani, Naveed A.

Introduction to multichip modules حسب Sherwani, N. A.

Physical design for multichip modules حسب Sriram, M. 1966-

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability حسب Pecht, Michael

Microelectronic system interconnections performance and modeling

Electronics packaging forum multichip module technology issues