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  1. 1

    Fundamentals of device and systems packaging technologies and applications

    Pubblicazione 2019
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of device and systems packaging technologies and applications
  2. 2

    MEMS packaging

    Pubblicazione 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    MEMS packaging
  3. 3

    RF and microwave microelectronics packaging II

    Pubblicazione 2017
    Available for University of the Philippines System via SpringerLink. Click here to access
    Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy
    Electronic Resource

    RF and microwave microelectronics packaging II
  4. 4

    3D IC integration and packaging di Lau, John H.

    Pubblicazione 2016
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    3D IC integration and packaging
  5. 5

    Advanced MEMS packaging

    Pubblicazione 2010
    Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Libro

    Advanced MEMS packaging
  6. 6

    Advanced MEMS packaging

    Pubblicazione 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Advanced MEMS packaging
  7. 7

    System-on-package (SOP) miniaturization of the entire system di Tummala, Rao R. 1942-

    Pubblicazione 2008
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    System-on-package (SOP) miniaturization of the entire system
  8. 8

    Introduction to system-on-package (SOP) miniaturization of the entire system di Tummala, Rao R. 1942-

    Pubblicazione 2008
    Table of contents only
    Libro

    Introduction to system-on-package (SOP) miniaturization of the entire system
  9. 9

    Quantum-well laser array packaging nanoscale packaging techniques

    Pubblicazione 2007
    Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy
    Electronic Resource

    Quantum-well laser array packaging nanoscale packaging techniques
  10. 10

    Quantum-well laser array packaging nanoscale packaging techniques

    Pubblicazione 2007
    Libro

    Quantum-well laser array packaging nanoscale packaging techniques

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