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Fundamentals of device and systems packaging technologies and applications
Argitaratua 2019Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
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3D IC integration and packaging
Argitaratua 2016Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Advanced MEMS packaging
Argitaratua 2010Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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System-on-package (SOP) miniaturization of the entire system
Argitaratua 2008Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Introduction to system-on-package (SOP) miniaturization of the entire system
Argitaratua 2008Table of contents only
Liburua -
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Quantum-well laser array packaging nanoscale packaging techniques
Argitaratua 2007Available for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill eBook Library. Click here to access thru Remote Access via EZProxy
Electronic Resource -
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