Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces di Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Fundamentals of lead-free solder interconnect technology from microstructures to reliability di Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Lead-free solder process development

Lead-free implementation and production a manufacturing guide di Hwang, Jennie S.

Table of contents