Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces de réir Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
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Fundamentals of lead-free solder interconnect technology from microstructures to reliability de réir Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

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Lead-free solder process development

Lead-free implementation and production a manufacturing guide de réir Hwang, Jennie S.

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