Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces Tekijä Zhang, Qingke

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Fundamentals of lead-free solder interconnect technology from microstructures to reliability Tekijä Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un, Ma, Hongtao

Available for University of the Philippines System via SpringerLink. Click here to access
Also available remotely for University of the Philippines System via SpringerLink. Click here to access thru EZproxy

Lead-free solder process development

Lead-free implementation and production a manufacturing guide Tekijä Hwang, Jennie S.

Table of contents