Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... 由 Manauis, Melissa B.

Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies 由 Borlasa, Ma. Eleanor Oyam

Physical metallurgy and processing of intermetallic compounds

Intermetallic compounds principles and practice

Handbook of crystal structures and magnetic properties of rare earth intermetallics 由 Szytula, Andrzej 1940-

Critical issues in the development of high temperature structural materials proceedings from the Conference on Critical Issues in the Development of High Temperature Structural Mat...

Rare earth intermetallics 由 Wallace, W. E. (William Edward) 1917-

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The constitution of inorganic compounds atomic quantum mechanics: metals and intermetallic compounds 由 Waugh, John L. T.

Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates 由 Mechilina, Aurelia Celebre