Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... door Manauis, Melissa B.

Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies door Borlasa, Ma. Eleanor Oyam

Physical metallurgy and processing of intermetallic compounds

Intermetallic compounds principles and practice

Handbook of crystal structures and magnetic properties of rare earth intermetallics door Szytula, Andrzej 1940-

Critical issues in the development of high temperature structural materials proceedings from the Conference on Critical Issues in the Development of High Temperature Structural Mat...

Rare earth intermetallics door Wallace, W. E. (William Edward) 1917-

Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy

The constitution of inorganic compounds atomic quantum mechanics: metals and intermetallic compounds door Waugh, John L. T.

Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates door Mechilina, Aurelia Celebre