Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... di Manauis, Melissa B.

Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies di Borlasa, Ma. Eleanor Oyam

Physical metallurgy and processing of intermetallic compounds

Intermetallic compounds principles and practice

Handbook of crystal structures and magnetic properties of rare earth intermetallics di Szytula, Andrzej 1940-

Critical issues in the development of high temperature structural materials proceedings from the Conference on Critical Issues in the Development of High Temperature Structural Mat...

Rare earth intermetallics di Wallace, W. E. (William Edward) 1917-

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The constitution of inorganic compounds atomic quantum mechanics: metals and intermetallic compounds di Waugh, John L. T.

Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates di Mechilina, Aurelia Celebre