Thermal aging effects on intermetallic compound growth kinetics and solder joint reliability performance involving Sn-1.2%Ag-0.5%Cu with Ni Dopant on copper organic solderability (... द्वारा Manauis, Melissa B.

Intermetallic phase formation and growth kinetics between Pb-free and eutectic Sn-Pb solder bumps on Cu-based under bump metallurgies द्वारा Borlasa, Ma. Eleanor Oyam

Physical metallurgy and processing of intermetallic compounds

Intermetallic compounds principles and practice

Handbook of crystal structures and magnetic properties of rare earth intermetallics द्वारा Szytula, Andrzej 1940-

Critical issues in the development of high temperature structural materials proceedings from the Conference on Critical Issues in the Development of High Temperature Structural Mat...

Rare earth intermetallics द्वारा Wallace, W. E. (William Edward) 1917-

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The constitution of inorganic compounds atomic quantum mechanics: metals and intermetallic compounds द्वारा Waugh, John L. T.

Comparative study of intermetallic compound formation in Sn-Ag-Cu and eutectic Sn-Pb solders on bare copper and electroless nickel immersion gold (ENIG) substrates द्वारा Mechilina, Aurelia Celebre