Mostra 1 - 10 risultati di 35 ricerca '', tempo di risposta: 0,02s Raffina i risultati
  1. 1

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.

    Pubblicazione 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.
  2. 2

    Reliability of power electronic converter systems

    Pubblicazione 2015
    Available for University of the Philippines Diliman via IET Digital Library. Click here to access
    Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
    Electronic Resource

    Reliability of power electronic converter systems
  3. 3

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits di Gustilo, Paul Angelo D.

    Pubblicazione 2014
    Tesi

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits
  4. 4

    Essentials of electronic packaging a multidisciplinary approach di Viswanadham, Puligandla

    Pubblicazione 2011
    Available for University of the Philippines Diliman College of Engineering via ASME. Click here to access
    Also available remotely for University of the Philippines Diliman College of Engineering via ASME. Click here to access thru EZproxy
    Electronic Resource

    Essentials of electronic packaging a multidisciplinary approach
  5. 5

    Adhesives technology for electronic applications materials, processing, reliability di Licari, James J. 1930-

    Pubblicazione 2011
    Available for University of the Philippines System via ScienceDirect. Click here to access
    Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
    Electronic Resource

    Adhesives technology for electronic applications materials, processing, reliability
  6. 6

    Advanced materials for thermal management of electronic packaging di Tong, Xingcun Colin

    Pubblicazione 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  7. 7

    Wire bonding in microelectronics di Harman, George G.

    Pubblicazione 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Wire bonding in microelectronics
  8. 8

    Nanopackaging nanotechnologies and electronics packaging

    Pubblicazione 2008
    Libro

    Nanopackaging nanotechnologies and electronics packaging
  9. 9

    Journal of electronic packaging.

    Pubblicazione 2004
    Libro

    Journal of electronic packaging.
  10. 10

    Fundamentals of microsystems packaging

    Pubblicazione 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of microsystems packaging

Strumenti per la ricerca: