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  1. 1

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.

    יצא לאור 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.
  2. 2

    Reliability of power electronic converter systems

    יצא לאור 2015
    Available for University of the Philippines Diliman via IET Digital Library. Click here to access
    Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
    Electronic Resource

    Reliability of power electronic converter systems
  3. 3

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits מאת Gustilo, Paul Angelo D.

    יצא לאור 2014
    Thesis

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits
  4. 4

    Essentials of electronic packaging a multidisciplinary approach מאת Viswanadham, Puligandla

    יצא לאור 2011
    Available for University of the Philippines Diliman College of Engineering via ASME. Click here to access
    Also available remotely for University of the Philippines Diliman College of Engineering via ASME. Click here to access thru EZproxy
    Electronic Resource

    Essentials of electronic packaging a multidisciplinary approach
  5. 5

    Adhesives technology for electronic applications materials, processing, reliability מאת Licari, James J. 1930-

    יצא לאור 2011
    Available for University of the Philippines System via ScienceDirect. Click here to access
    Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
    Electronic Resource

    Adhesives technology for electronic applications materials, processing, reliability
  6. 6

    Advanced materials for thermal management of electronic packaging מאת Tong, Xingcun Colin

    יצא לאור 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  7. 7

    Wire bonding in microelectronics מאת Harman, George G.

    יצא לאור 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Wire bonding in microelectronics
  8. 8

    Nanopackaging nanotechnologies and electronics packaging

    יצא לאור 2008
    ספר

    Nanopackaging nanotechnologies and electronics packaging
  9. 9

    Journal of electronic packaging.

    יצא לאור 2004
    ספר

    Journal of electronic packaging.
  10. 10

    Fundamentals of microsystems packaging

    יצא לאור 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of microsystems packaging

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