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Encyclopedia of thermal packaging a guide to cooling of electronic equipment.
Foilsithe / Cruthaithe 2018Available for University of the Philippines Diliman via World Scientific. Click here to access
Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
Electronic Resource -
2
Reliability of power electronic converter systems
Foilsithe / Cruthaithe 2015Available for University of the Philippines Diliman via IET Digital Library. Click here to access
Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
Electronic Resource -
3
Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits
Foilsithe / Cruthaithe 2014Tráchtas -
4
Essentials of electronic packaging a multidisciplinary approach
Foilsithe / Cruthaithe 2011Available for University of the Philippines Diliman College of Engineering via ASME. Click here to access
Also available remotely for University of the Philippines Diliman College of Engineering via ASME. Click here to access thru EZproxy
Electronic Resource -
5
Adhesives technology for electronic applications materials, processing, reliability
Foilsithe / Cruthaithe 2011Available for University of the Philippines System via ScienceDirect. Click here to access
Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
Electronic Resource -
6
Advanced materials for thermal management of electronic packaging
Foilsithe / Cruthaithe 2011Available for University of the Philippines Diliman via SpringerLink. Click here to access
Electronic Resource -
7
Wire bonding in microelectronics
Foilsithe / Cruthaithe 2010Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource -
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Fundamentals of microsystems packaging
Foilsithe / Cruthaithe 2001Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
Electronic Resource