Zobrazuji výsledky 1 - 10 z 35 pro vyhledávání '', doba hledání: 0,01 s. Upřesnit hledání
  1. 1

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.

    Vydáno 2018
    Available for University of the Philippines Diliman via World Scientific. Click here to access
    Also available remotely for University of the Philippines Diliman via World Scientific. Click here to access thru EZproxy
    Electronic Resource

    Encyclopedia of thermal packaging a guide to cooling of electronic equipment.
  2. 2

    Reliability of power electronic converter systems

    Vydáno 2015
    Available for University of the Philippines Diliman via IET Digital Library. Click here to access
    Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy
    Electronic Resource

    Reliability of power electronic converter systems
  3. 3

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits Autor Gustilo, Paul Angelo D.

    Vydáno 2014
    Diplomová práce

    Equilibrium, kinetics, and thermodynamics of moisture adsorption on plastic encapsulated microcircuits
  4. 4

    Essentials of electronic packaging a multidisciplinary approach Autor Viswanadham, Puligandla

    Vydáno 2011
    Available for University of the Philippines Diliman College of Engineering via ASME. Click here to access
    Also available remotely for University of the Philippines Diliman College of Engineering via ASME. Click here to access thru EZproxy
    Electronic Resource

    Essentials of electronic packaging a multidisciplinary approach
  5. 5

    Adhesives technology for electronic applications materials, processing, reliability Autor Licari, James J. 1930-

    Vydáno 2011
    Available for University of the Philippines System via ScienceDirect. Click here to access
    Also available remotely for University of the Philippines System via ScienceDirect. Click here to access thru EZproxy
    Electronic Resource

    Adhesives technology for electronic applications materials, processing, reliability
  6. 6

    Advanced materials for thermal management of electronic packaging Autor Tong, Xingcun Colin

    Vydáno 2011
    Available for University of the Philippines Diliman via SpringerLink. Click here to access
    Electronic Resource

    Advanced materials for thermal management of electronic packaging
  7. 7

    Wire bonding in microelectronics Autor Harman, George G.

    Vydáno 2010
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Wire bonding in microelectronics
  8. 8

    Nanopackaging nanotechnologies and electronics packaging

    Vydáno 2008
    Kniha

    Nanopackaging nanotechnologies and electronics packaging
  9. 9

    Journal of electronic packaging.

    Vydáno 2004
    Kniha

    Journal of electronic packaging.
  10. 10

    Fundamentals of microsystems packaging

    Vydáno 2001
    Available for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access
    Also available remotely for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access thru EZproxy
    Electronic Resource

    Fundamentals of microsystems packaging

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